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Inventor profile of:

Guido Bernet

City:

Sempach

Country:

Switzerland

Published Applications:

1

Last publication date:

2007-05-03

Recent patent applications by Bernet Guido

Guido Bernet from Sempach, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-03

US20070095795A1

Performing operations; transporting

Assembly fixture and method for machining injection mold tooling

InventorID:

4402087 ⎘