John U. Knickerbocker

City:

Hopewell Junction, New York

Country:

United States

Published Applications:

Last publication date:

2007-05-03

Top Assignees for applications by John U. Knickerbocker

The entities that hold a legal rights for patent applications filed by inventor Knickerbocker John U.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 5 ARMONK, NY United States

Recent patent applications by Knickerbocker John U.

John U. Knickerbocker from Hopewell Junction, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-03

US20070099342A1

Electricity

Method of fabricating a BGA package having decreased adhesion

#2 | 2006-12-12

US9817843

Method and structure for an organic package with improved BGA life

#3 | 2006-01-10

US10427459

Dielectric interposer for chip to substrate soldering

#4 | 2005-12-13

US10462275

Discrete magnets in dielectric forming metal/ceramic laminate and process thereof

#5 | 2005-09-13

US10885856

Interposer capacitor built on silicon wafer and joined to a ceramic substrate

InventorID:

4404591 ⎘