Setsuto Daiza

City:

Aichi-ken

Country:

Japan

Published Applications:

Last publication date:

2007-05-17

Top Assignees for applications by Setsuto Daiza

The entities that hold a legal rights for patent applications filed by inventor Daiza Setsuto:

Setsuto Daiza from Aichi-ken, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin substrate having a resin-metal composite layer and method for manufacturing thereof

InventorID:

4413402 ⎘