Monte Sereno, California
United States
25
2007-11-06
The entities that hold a legal rights for patent applications filed by inventor DiStefano Thomas H.:
Thomas H. DiStefano from Monte Sereno, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor chip assemblies, methods of making same and components for same
#2 | 2007-09-25Method of fabricating semiconductor chip assemblies
#3 | 2007-08-23High performance electrical connector
#4 | 2007-05-17Circuit board and method of manufacture thereof
#5 | 2007-04-03Semiconductor chip assemblies, methods of making same and components for same
#6 | 2007-01-23Method of electroplating stressed metal springs
#7 | 2007-01-23Semiconductor package with heat sink
#8 | 2006-12-26Enhancements in framed sheet processing
#9 | 2006-11-02Microelectronic component and assembly having leads with offset portions
#10 | 2006-10-12Method of fabricating semiconductor chip assemblies
#11 | 2006-08-29Microelectronic component and assembly having leads with offset portions
#12 | 2006-07-18Microelectronic packages with elongated solder interconnections
#13 | 2006-06-27Connection component with peelable leads
#14 | 2006-06-22Methods for fabricating thin complaint spring contacts
#15 | 2006-06-01Microelectronic packages with solder interconnections
#16 | 2006-03-09Methods of making microelectronic assemblies including compliant interfaces
#17 | 2006-02-23Method for making a microelectronic interposer
#18 | 2006-01-12Flexible cable interconnect assembly
#19 | 2005-12-27Method for making a microelectronic interposer
#20 | 2005-10-06Microelectronic assembly having encapsulated wire bonding leads
#21 | 2005-09-06Method of making an electronic contact
#22 | 2005-06-23Flexible cable interconnect assembly
#23 | 2005-05-24Method of making a compliant integrated circuit package
#24 | 2005-05-03Connection components with frangible leads and bus
#25 | 2005-04-28Microelectronic component and assembly having leads with offset portions
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