Tomoko Aoki

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2007-05-24

Top Assignees for applications by Tomoko Aoki

The entities that hold a legal rights for patent applications filed by inventor Aoki Tomoko:

AZ ELECTRONIC MATERIALS USA CORP. 2 SOMERVILLE, NJ United States
CLARIANT (JAPAN) K.K. 1 Tokyo, Japan

Recent patent applications by Aoki Tomoko

Tomoko Aoki from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-24

US20070117892A1

Electricity

Coating composition, porous silica-based film, method for producing porous silica-based film and semiconductor device

#2 | 2006-11-02

US20060246303A1

Chemistry; metallurgy

Coating composition and low dielectric siliceous material produced by using same

#3 | 2006-09-28

US20060217487A1

Electricity

Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device

InventorID:

4418611 ⎘