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Inventor profile of:

Michael E. Hetrick

City:

Dayton, Ohio

Country:

United States

Published Applications:

1

Last publication date:

2007-05-31

Recent patent applications by Hetrick Michael E.

Michael E. Hetrick from Dayton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-31

US20070120943A1

Performing operations; transporting

Dual-sided thermal printing with labels

InventorID:

4420918 ⎘