Earnest C. Murphy

City:

St. James, Missouri

Country:

United States

Published Applications:

Last publication date:

2007-05-31

Top Assignees for applications by Earnest C. Murphy

The entities that hold a legal rights for patent applications filed by inventor Murphy Earnest C.:

BREWER SCIENCE INC. 2 Rolla, MO United States

Recent patent applications by Murphy Earnest C.

Earnest C. Murphy from St. James, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-31

US20070123036A1

Electricity

Method of filling structures for forming via-first dual damascene interconnects

#2 | 2005-06-02

US20050118800A1

Electricity

Method of filling structures for forming via-first dual damascene interconnects

InventorID:

4422386 ⎘