Feng Chen

City:

Bothell, Washington

Country:

United States

Published Applications:

Last publication date:

2007-06-28

Recent patent applications by Chen Feng

Feng Chen from Bothell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Assembly of image-sensing chip and circuit board with inward wire bonding

Packaging method for an assembly of image-sensing chip and circuit board

InventorID:

4439083 ⎘