Ho-Sik Jun

City:

Chungcheongbuk-do

Country:

South Korea

Published Applications:

Last publication date:

2007-06-28

Top Assignees for applications by Ho-Sik Jun

The entities that hold a legal rights for patent applications filed by inventor Jun Ho-Sik:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyeonggi-do, South Korea
Samsung Electro-Mechanics Co., Ltd. 1 Kyunggi-do, South Korea
Samsung Electro-Mechanics Co., Ltd. 1 Suwon-shi, South Korea

Recent patent applications by Jun Ho-Sik

Ho-Sik Jun from Chungcheongbuk-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-06-28

US20070146980A1

Electricity

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIELECTRIC CONSTANT AND METHOD OF FABRICATING SAME

#2 | 2006-03-02

US20060044734A1

Electricity

Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

#3 | 2006-01-19

US20060014327A1

Electricity

Method of fabricating PCB including embedded passive chip

InventorID:

4440146 ⎘