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Inventor profile of:

Prasanna Raghavan

City:

Country:

United States

Published Applications:

1

Last publication date:

2007-07-05

Recent patent applications by Raghavan Prasanna

Prasanna Raghavan from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-05

US20070152314A1

Low stress stacked die packages

InventorID:

4444035 ⎘