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Inventor profile of:

Guido Hoffmann

City:

Wettingen

Country:

Switzerland

Published Applications:

1

Last publication date:

2007-07-12

Recent patent applications by Hoffmann Guido

Guido Hoffmann from Wettingen, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-12

US20070159291A1

High-voltage thick-film high rupturing capacity substrate fuse

InventorID:

4448942 ⎘