William S. Steinhoff

City:

Plantation, Florida

Country:

United States

Published Applications:

Last publication date:

2007-07-12

Top Assignees for applications by William S. Steinhoff

The entities that hold a legal rights for patent applications filed by inventor Steinhoff William S.:

MOTOROLA, INC. 1 Schaumburg, IL United States

Recent patent applications by Steinhoff William S.

William S. Steinhoff from Plantation, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-12

US20070159801A1

Electricity

Insert molded flexible circuit with stiffener and flip housing assembly and method of manufacture

InventorID:

4449290 ⎘