Ching-Bin Lin

City:

Hsinchu Hsien

Country:

Taiwan

Published Applications:

Last publication date:

2007-07-19

Top Assignees for applications by Ching-Bin Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Ching-Bin:

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 1 Hsinchu Hsien, Taiwan

Recent patent applications by Lin Ching-Bin

Ching-Bin Lin from Hsinchu Hsien, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-19

US20070166874A1

Physics

Fabrication Method of Nanoimprint Mold Core

#2 | 2006-05-25

US20060110125A1

Physics

Fabrication method of nanoimprint mold core

InventorID:

4454488 ⎘