Shing-Chyang Pan

City:

Tainan

Country:

Taiwan

Published Applications:

Last publication date:

2007-08-09

Top Assignees for applications by Shing-Chyang Pan

The entities that hold a legal rights for patent applications filed by inventor Pan Shing-Chyang:

Shing-Chyang Pan from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and apparatus for fabricating metal layer

Method of avoiding plasma arcing during RIE etching

Method and apparatus for fabricating metal layer

Refractory metal nitride barrier layer with gradient nitrogen concentration

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Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers

InventorID:

4464785 ⎘