Benjamin E. Burrows

City:

St. Louis Park, Minnesota

Country:

United States

Published Applications:

Last publication date:

2007-08-09

Recent patent applications by Burrows Benjamin E.

Benjamin E. Burrows from St. Louis Park, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-08-09

US20070185301A1

Chemistry; metallurgy

Moisture cure adhesive for bonding structural wood

InventorID:

4467480 ⎘