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Inventor profile of:

Satoshi Ito

City:

Kariya

Country:

Japan

Published Applications:

Last publication date:

2024-07-18

Top Assignees for applications by Satoshi Ito

The entities that hold a legal rights for patent applications filed by inventor Ito Satoshi:

DENSO CORPORATION 9 Kariya, Japan
TOYOTA JIDOSHA KABUSHIKI KAISHA 3 Toyota-shi, Japan
TOYOTA JIDOSHA KABUSHIKI KAISHA 2 Toyota, Japan
DENSO CORPORATION 2 Kariya-city, Japan
TOYOTA JIDOSHA KABUSHIKI KAISHA 1 Aichi-ken, Japan
Kabushiki Kaisha Toyota Jidoshokki 1 , Japan
TOKAI KOGYO CO., LTD. 1 Aichi-ken, Japan
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 1 Kariya-shi, Japan
TOKAI KOGYO CO., LTD. 1 Obu-shi, Japan

Recent patent applications by Ito Satoshi

Satoshi Ito from Kariya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-18

US20240239158A1

Performing operations; transporting

IN-VEHICLE TEMPERATURE CONTROL SYSTEM

#2 | 2024-07-18

US20240239157A1

Performing operations; transporting

IN-VEHICLE TEMPERATURE CONTROL SYSTEM

#3 | 2021-11-11

US20210347224A1

Performing operations; transporting

Refrigeration cycle device

#4 | 2021-06-24

US20210190389A1

Mechanical engineering

Refrigeration cycle device

#5 | 2021-04-15

US20210108841A1

Mechanical engineering

Refrigeration cycle device for vehicle

#6 | 2021-04-08

US20210102716A1

Mechanical engineering

Refrigeration cycle device

#7 | 2021-04-08

US20210101450A1

Performing operations; transporting

Refrigeration cycle device

#8 | 2020-04-02

US20200101819A1

Performing operations; transporting

Air conditioner, air conditioning system, and air-conditioning controller

#9 | 2019-01-31

US20190032979A1

Mechanical engineering

Refrigeration cycle device

#10 | 2018-12-06

US20180347526A1

Mechanical engineering

Fuel pump and fuel pump module

#11 | 2016-06-30

US20160189862A1

Electricity

Method of manufacturing reactor

#12 | 2007-08-23

US20070194428A1

Electricity

Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole

InventorID:

4474029 ⎘