Hugh E. Stroupe

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2007-09-06

Top Assignees for applications by Hugh E. Stroupe

The entities that hold a legal rights for patent applications filed by inventor Stroupe Hugh E.:

Hugh E. Stroupe from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Apparatus and methods for selective removal of material from wafer alignment marks

Methods for selective removal of material from wafer alignment marks

Technique for attaching die to leads

Technique for attaching die to leads

Apparatus for selective removal of material from wafer alignment marks

Technique for attaching die to leads

Technique for attaching die to leads

InventorID:

4483131 ⎘