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Inventor profile of:

Jun-Ren Chen

City:

Hsinchu

Country:

Taiwan

Published Applications:

1

Last publication date:

2007-09-13

Recent patent applications by Chen Jun-Ren

Jun-Ren Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-09-13

US20070212867A1

Method and structure for improving bonding reliability in bond pads

InventorID:

4486716 ⎘