Daisuke Hirokane

City:

Tochigi

Country:

Japan

Published Applications:

Last publication date:

2007-09-20

Top Assignees for applications by Daisuke Hirokane

The entities that hold a legal rights for patent applications filed by inventor Hirokane Daisuke:

Daisuke Hirokane from Tochigi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices

InventorID:

4488891 ⎘