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Inventor profile of:

Tomoo Iijima

City:

Tokyo

Country:

Japan

Published Applications:

19

Last publication date:

2017-06-15

Top Assignees for applications by Tomoo Iijima

The entities that hold a legal rights for patent applications filed by inventor Iijima Tomoo:

TESSERA INTERCONNECT MATERIALS, INC. 11 San Jose, CA United States
NORTH CORPORATION 5 TOKYO, Japan
INVENSAS CORPORATION 4 San Jose, CA United States
Sony Chemical & Information Device Corporation 1 , Japan
Sony Chemicals Corporation 1 Tokyo, Japan
SONY CHEMICAL &INFORMATION DEVICE CORPORATION 1 TOKYO, Japan

Recent patent applications by Iijima Tomoo

Tomoo Iijima from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-06-15

US20170171986A1

Multilayer wiring board for an electronic device

#2 | 2014-08-28

US20140240934A1

Multilayer wiring board for an electronic device

#3 | 2013-09-26

US20130247372A1

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

#4 | 2011-03-10

US20110057324A1

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#5 | 2010-09-30

US20100242270A1

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

#6 | 2008-12-04

US20080296254A1

Multilayer wiring board for an electronic device

#7 | 2008-07-17

US20080169568A1

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#8 | 2008-06-12

US20080136041A1

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#9 | 2008-05-15

US20080110018A1

Method for manufacturing multilayer wiring board

#10 | 2007-09-13

US20070209199A1

Methods of making microelectronic assemblies

#11 | 2007-07-26

US20070170598A1

FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-LAYER WIRING CIRCUIT BOARD, AND METHOD FOR MAKING THE SAME

#12 | 2007-05-31

US20070121305A1

Multilayer wiring board for an electronic device

#13 | 2006-11-16

US20060258139A1

Manufacturing method for wiring circuit substrate

#14 | 2006-08-29

US10823611

Manufacturing method for wiring circuit substrate

#15 | 2005-10-13

US20050224256A1

Interlayer member used for producing multilayer wiring board and method of producing the same

#16 | 2005-07-28

US20050161804A1

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

#17 | 2005-05-12

US20050097727A1

Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board

#18 | 2005-04-26

US10358229

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

#19 | 2005-01-06

US20050000729A1

Multilayer wiring board for an electronic device

InventorID:

449353 ⎘