Kazuhiro YOSHIKAWA

City:

Saitama

Country:

Japan

Published Applications:

Last publication date:

2015-02-12

Top Assignees for applications by Kazuhiro YOSHIKAWA

The entities that hold a legal rights for patent applications filed by inventor YOSHIKAWA Kazuhiro:

MITSUI MINING & SMELTING CO., LTD. 2 Tokyo, Japan
MITSUI MINING & SMELTING CO., LTD. 1 Tokyo, Japan

Recent patent applications by YOSHIKAWA Kazuhiro

Kazuhiro YOSHIKAWA from Saitama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-02-12

US20150044492A1

Electricity

Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil

#2 | 2013-09-26

US20130247373A1

Electricity

Method of producing a printed wiring board

InventorID:

449357 ⎘