Walnut, California
United States
39
2026-04-30
The entities that hold a legal rights for patent applications filed by inventor Chen Chi-She:
Chi-She Chen from Walnut, US has applied for patents for these inventions. The list has both pending applications and granted patents:
FLASH-DRAM HYBRID MEMORY MODULE
#2 | 2025-10-30FLASH-DRAM HYBRID MEMORY MODULE
#3 | 2023-11-30MEMORY MODULE HAVING VOLATILE AND NON-VOLATILE MEMORY SUBSYSTEMS AND METHOD OF OPERATION
#4 | 2022-08-11Memory module having volatile and non-volatile memory subsystems and method of operation
#5 | 2022-07-14FLASH-DRAM HYBRID MEMORY MODULE
#6 | 2021-09-09Flash-dram hybrid memory module
#7 | 2021-04-29Flash-DRAM hybrid memory module
#8 | 2020-02-06Hybrid memory module and system and method of operating the same
#9 | 2019-01-03FLASH-DRAM HYBRID MEMORY MODULE
#10 | 2018-07-17Memory module and circuit providing load isolation and noise reduction
#11 | 2016-11-24ISOLATION SWITCHING FOR BACKUP MEMORY
#12 | 2016-07-07Flash-DRAM hybrid memory module
#13 | 2015-09-10Isolation switching for backup memory
#14 | 2015-09-03Redundant backup using non-volatile memory
#15 | 2015-08-27Flash-DRAM hybrid memory module
#16 | 2015-06-18Hybrid memory module and system and method of operating the same
#17 | 2015-05-19Memory module with circuit providing load isolation and noise reduction
#18 | 2015-03-03Module having at least one thermally conductive layer between printed circuit boards
#19 | 2014-10-21Electronic module with flexible portion
#20 | 2014-06-05Isolation switching for backup of registered memory
#21 | 2014-06-05Isolation switching for backup memory
#22 | 2013-09-26Isolation switching for backup of registered memory
#23 | 2013-09-26Isolation switching for backup memory
#24 | 2013-04-04Flash-DRAM hybrid memory module
#25 | 2013-01-17Redundant backup using non-volatile memory
#26 | 2012-10-30Non-volatile memory module
#27 | 2012-10-25Data transfer scheme for non-volatile memory module
#28 | 2012-10-16Circuit with flexible portion
#29 | 2012-10-04Circuit providing load isolation and noise reduction
#30 | 2012-04-10Circuit providing load isolation and noise reduction
#31 | 2011-10-11Circuit with flexible portion
#32 | 2011-05-12Module having at least two surfaces and at least one thermally conductive layer therebetween
#33 | 2010-10-12Circuit with flexible portion
#34 | 2010-05-06Module having at least two surfaces and at least one thermally conductive layer therebetween
#35 | 2008-12-25High density module having at least two substrates and at least one thermally conductive layer therebetween
#36 | 2008-10-28Circuit card with flexible connection for memory module with heat spreader
#37 | 2008-01-10High density memory module using stacked printed circuit boards
#38 | 2006-03-02High density memory module using stacked printed circuit boards
#39 | 2005-03-10Stackable electronic assembly
44945 ⎘