Eric Lin

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2007-10-04

Top Assignees for applications by Eric Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Eric:

Eric Lin from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

InventorID:

4499243 ⎘