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Inventor profile of:

Jack Hu

City:

Pingzhen City

Country:

Taiwan

Published Applications:

1

Last publication date:

2007-10-11

Recent patent applications by Hu Jack

Jack Hu from Pingzhen City, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-10-11

US20070235862A1

Hybrid flip-chip and wire-bond connection package system

InventorID:

4501752 ⎘