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Inventor profile of:

Tomozo Ogawa

City:

Mie

Country:

Japan

Published Applications:

1

Last publication date:

2007-10-11

Top Assignees for applications by Tomozo Ogawa

The entities that hold a legal rights for patent applications filed by inventor Ogawa Tomozo:

RIKEN TECHNOS CORPORATION 1 Tokyo, Japan

Recent patent applications by Ogawa Tomozo

Tomozo Ogawa from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-10-11

US20070237922A1

Performing operations; transporting

Extrusion molded article for automobiles

InventorID:

4502914 ⎘