Jiang hua Java Zhu

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2007-11-01

Top Assignees for applications by Jiang hua Java Zhu

The entities that hold a legal rights for patent applications filed by inventor Java Zhu Jiang hua:

SANDISK TECHNOLOGIES INC. 1 PLANO, TX United States
SanDisk Corporation 1 Milpitas, CA United States

Recent patent applications by Java Zhu Jiang hua

Jiang hua Java Zhu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-11-01

US20070254407A1

Electricity

Method of reducing mechanical stress on a semiconductor die during fabrication

#2 | 2007-11-01

US20070252254A1

Electricity

Molded SiP package with reinforced solder columns

InventorID:

4512428 ⎘