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Inventor profile of:

Daisuke Takayama

City:

Osaka-shi

Country:

Japan

Published Applications:

1

Last publication date:

2007-11-15

Recent patent applications by Takayama Daisuke

Daisuke Takayama from Osaka-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-11-15

US20070262472A1

High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor

InventorID:

4519086 ⎘