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Inventor profile of:

Sou Arikawa

City:

Aichi

Country:

Japan

Published Applications:

1

Last publication date:

2007-11-22

Top Assignees for applications by Sou Arikawa

The entities that hold a legal rights for patent applications filed by inventor Arikawa Sou:

Yazaki Corporation 1 Tokyo, Japan

Recent patent applications by Arikawa Sou

Sou Arikawa from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-11-22

US20070267208A1

Shield wire

InventorID:

4522170 ⎘