Uthappa Devaiah Mandepanda

City:

Wayne, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2007-11-29

Recent patent applications by Mandepanda Uthappa Devaiah

Uthappa Devaiah Mandepanda from Wayne, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-11-29

US20070272609A1

Chemistry; metallurgy

Reuse of waste materials via manure additive

InventorID:

4525747 ⎘