Jerwei Hsieh

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2026-02-05

Top Assignees for applications by Jerwei Hsieh

The entities that hold a legal rights for patent applications filed by inventor Hsieh Jerwei:

Jerwei Hsieh from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

STRESS SENSING ELEMENT HAVING DIAPHRAGM WITH VERTICAL PROTRUSIONS

Integrated MEMS device

Method for manufacturing an integrated MEMS device

Package structure and substrate bonding method

Apparatus for driving microfluid and driving method thereof

Tunable dispersive optical system

InventorID:

4534621 ⎘