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Inventor profile of:

Michael McKeag

City:

Aloha, Oregon

Country:

United States

Published Applications:

1

Last publication date:

2007-12-27

Recent patent applications by McKeag Michael

Michael McKeag from Aloha, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-12-27

US20070298607A1

Method for copper damascence fill for forming an interconnect

InventorID:

4542316 ⎘