Boise, Idaho
United States
8
2006-10-12
The entities that hold a legal rights for patent applications filed by inventor Benson Peter:
Peter Benson from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods for forming backside alignment markers useable in semiconductor lithography
#2 | 2006-01-12Materials for use in programmed material consolidation processes
#3 | 2006-01-05Assemblies including semiconductor substrates of reduced thickness and support structures therefor
#4 | 2006-01-05Methods for optimizing physical characteristics of selectively consolidatable materials
#5 | 2006-01-05Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
#6 | 2005-11-10Methods for forming backside alignment markers useable in semiconductor lithography
#7 | 2005-11-10Methods for clearing alignment markers useable in semiconductor lithography
#8 | 2005-03-24Methods for thinning semiconductor substrates that employ support structures formed on the substrates
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