Shaw-Wei Chen

City:

HsinChu

Country:

Taiwan

Published Applications:

Last publication date:

2006-02-09

Top Assignees for applications by Shaw-Wei Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Shaw-Wei:

Shaw-Wei Chen from HsinChu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Electroplated wire layout for package sawing

Packaging stacked chips with finger structure

InventorID:

4544479 ⎘