Jae-Cheon Do

City:

Chungcheongnam-do

Country:

South Korea

Published Applications:

Last publication date:

2006-01-12

Top Assignees for applications by Jae-Cheon Do

The entities that hold a legal rights for patent applications filed by inventor Do Jae-Cheon:

SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea
Samsung Electronics Co., Ltd. 1 Yeongtong-Gu, Suwon-si, Gyeonggi-Do, South Korea

Recent patent applications by Do Jae-Cheon

Jae-Cheon Do from Chungcheongnam-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-01-12

US20060006486A1

Electricity

Image sensor package and method of manufacturing the same

#2 | 2005-12-29

US20050285016A1

Electricity

Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure

InventorID:

4549036 ⎘