Peng Su

City:

Austin, Texas

Country:

United States

Published Applications:

Last publication date:

2006-12-28

Top Assignees for applications by Peng Su

The entities that hold a legal rights for patent applications filed by inventor Su Peng:

Peng Su from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Mechanical integrity evaluation of low-k devices with bump shear

Solderable metal finish for integrated circuit package leads and method for forming

InventorID:

4562519 ⎘