Inventor profile of:

Daniel A. Steigerwald

City:

Cupertino, California

Country:

United States

Published Applications:

32

Last publication date:

2021-04-15

Top Assignees for applications by Daniel A. Steigerwald

The entities that hold a legal rights for patent applications filed by inventor Steigerwald Daniel A.:

Recent patent applications by Steigerwald Daniel A.

Daniel A. Steigerwald from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-04-15
US20210111321A1
Electricity

Passivation for a semiconductor light emitting device

#2 | 2019-01-24
US20190027664A1
Electricity

Passivation for a semiconductor light emitting device

#3 | 2016-07-14
US20160204315A1
Electricity

Passivation for a semiconductor light emitting device

#4 | 2013-09-26
US20130252358A1
Electricity

Passivation for a semiconductor light emitting device

#5 | 2012-02-02
US20120025231A1
Electricity

Series connected flip chip LEDs with growth substrate removed

#6 | 2011-12-08
US20110297979A1
Electricity

Passivation for a semiconductor light emitting device

#7 | 2011-06-09
US20110136273A1
Electricity

REFLECTIVE CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

#8 | 2011-03-10
US20110057569A1
Electricity

Zener diode protection network in submount for LEDs connected in series

#9 | 2010-08-19
US20100207157A1
Electricity

LED assembly having maximum metal support for laser lift-off of growth substrate

#10 | 2010-05-06
US20100109030A1
Electricity

Series connected flip chip LEDs with growth substrate removed

#11 | 2010-01-14
US20100006864A1
Electricity

IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS

#12 | 2009-10-08
US20090250713A1
Electricity

Reflective Contact for a Semiconductor Light Emitting Device

#13 | 2008-06-19
US20080142833A1
Electricity

Interconnects for semiconductor light emitting devices

#14 | 2007-05-03
US20070096130A1
Electricity

LED assembly having maximum metal support for laser lift-off of growth substrate

#15 | 2007-03-15
US20070057271A1
Electricity

Interconnects for semiconductor light emitting devices

#16 | 2006-12-07
US20060273339A1
Electricity

Contacting scheme for large and small area semiconductor light emitting flip chip devices

#17 | 2006-07-04
US10317956
-

Light emitting device with enhanced optical scattering

#18 | 2006-05-23
US10166853
-

Axial LED source

#19 | 2006-05-11
US20060097336A1
Electricity

High-powered light emitting device with improved thermal properties

#20 | 2006-03-21
US10705156
-

Semiconductor light emitting device and method

#21 | 2005-12-20
US10369714
-

High-powered light emitting device with improved thermal properties

#22 | 2005-11-29
US10669789
-

Enhanced brightness light emitting device spot emitter

#23 | 2005-09-20
US10867936
-

III-Phosphide and III-Arsenide flip chip light-emitting devices

#24 | 2005-09-20
US9652194
-

Light emitting semiconductor method and device

#25 | 2005-08-18
US20050179041A1
Electricity

Illumination system with LEDs

#26 | 2005-08-04
US20050167693A1
Electricity

Formation of Ohmic contacts in III-nitride light emitting devices

#27 | 2005-07-05
US10721440
-

Formation of Ohmic contacts in III-nitride light emitting devices

#28 | 2005-05-10
US10461173
-

Semiconductor LED flip-chip with dielectric coating on the mesa

#29 | 2005-05-05
US20050093007A1
Electricity

Light emitting devices with enhanced luminous efficiency

#30 | 2005-04-26
US9859154
-

Multi-chip semiconductor LED assembly

#31 | 2005-03-31
US20050067624A1
Electricity

Contacting scheme for large and small area semiconductor light emitting flip chip devices

#32 | 2005-01-18
US10071507
-

III-nitride light-emitting device with increased light generating capability

InventorID:

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