Boise, Idaho
United States
9
2007-01-30
The entities that hold a legal rights for patent applications filed by inventor Connell Mike:
Mike Connell from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate
#2 | 2006-12-28Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#3 | 2006-02-09Method for fabricating semiconductor package with circuit side polymer layer
#4 | 2006-02-09Methods of fabricating integrated circuitry
#5 | 2006-02-09Substrate comprising a plurality of integrated circuitry die, and a substrate
#6 | 2006-02-07Semiconductor package with circuit side polymer layer and wafer level fabrication method
#7 | 2005-09-27Stacked semiconductor package with circuit side polymer layer
#8 | 2005-07-21Protective layer for use in packaging a semiconductor die and method for forming same
#9 | 2005-04-19Method for forming a protective layer for use in packaging a semiconductor die
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