Jong Suk Bae

City:

Busan

Country:

South Korea

Published Applications:

Last publication date:

2007-10-11

Top Assignees for applications by Jong Suk Bae

The entities that hold a legal rights for patent applications filed by inventor Bae Jong Suk:

Jong Suk Bae from Busan, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Printed circuit board using bump and method for manufacturing thereof

Method of fabricating package substrate using electroless nickel plating

Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

InventorID:

4581596 ⎘