Hiroki Ishikawa

City:

Aichi Prefecture

Country:

Japan

Published Applications:

Last publication date:

2006-03-02

Top Assignees for applications by Hiroki Ishikawa

The entities that hold a legal rights for patent applications filed by inventor Ishikawa Hiroki:

Dow Corning Toray Silicone Co., Ltd. 1 Tokyo, Japan
Dow Corning Toray Silicone Company, Ltd. 1 Tokyo, Japan
DOW CORNING TORAY COMPANY, LTD. 1 Tokyo, Japan

Recent patent applications by Ishikawa Hiroki

Hiroki Ishikawa from Aichi Prefecture, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-03-02

US20060047043A1

Chemistry; metallurgy

Silver-based powder, method of preparation thereof, and curable silicone composition

#2 | 2005-10-27

US20050239940A1

Electricity

Electrically conductive silicone rubber composition

#3 | 2005-08-18

US20050181213A1

Chemistry; metallurgy

Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

InventorID:

4582003 ⎘