Michael E. Connell

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2007-01-30

Top Assignees for applications by Michael E. Connell

The entities that hold a legal rights for patent applications filed by inventor Connell Michael E.:

Michael E. Connell from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive

Fabrication of stacked microelectronic devices

Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive

Packaged stacked semiconductor die and method of preparing same

Apparatuses for forming thin microelectronic dies

Fabrication of stacked microelectronic devices

InventorID:

4586093 ⎘