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Inventor profile of:

Guy LeFranc

City:

Munich

Country:

Germany

Published Applications:

1

Last publication date:

2006-03-16

Top Assignees for applications by Guy LeFranc

The entities that hold a legal rights for patent applications filed by inventor LeFranc Guy:

EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH 1 , Germany

Recent patent applications by LeFranc Guy

Guy LeFranc from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-03-16

US20060055041A1

Bonding wire and bonded connection

InventorID:

4588658 ⎘