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Inventor profile of:

Brian C. Smith

City:

Pulaski, Wisconsin

Country:

United States

Published Applications:

1

Last publication date:

2006-03-30

Recent patent applications by Smith Brian C.

Brian C. Smith from Pulaski, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-03-30

US20060065357A1

Performing operations; transporting

Process for manufacturing packaging laminates and articles made therefrom

InventorID:

4596850 ⎘