Boise, Idaho
United States
7
2006-08-22
The entities that hold a legal rights for patent applications filed by inventor Tandy William D.:
William D. Tandy from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
#2 | 2006-06-29Integrated circuit device having reduced bow and method for making same
#3 | 2006-04-13Methods for marking a bare semiconductor die including applying a tape having energy-markable properties
#4 | 2005-05-03Method for making an integrated circuit package having reduced bow
#5 | 2005-02-24Semiconductor component having dummy segments with trapped corner air
#6 | 2005-02-17Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
#7 | 2005-02-03Integrated circuit device having reduced bow and method for making same
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