David E. Eichstadt

City:

North Salem, New York

Country:

United States

Published Applications:

Last publication date:

2006-04-20

Top Assignees for applications by David E. Eichstadt

The entities that hold a legal rights for patent applications filed by inventor Eichstadt David E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 6 ARMONK, NY United States

Recent patent applications by Eichstadt David E.

David E. Eichstadt from North Salem, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-04-20

US20060081981A1

Electricity

Method of forming a bond pad on an I/C chip and resulting structure

#2 | 2005-05-19

US20050104208A1

Electricity

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

#3 | 2005-05-19

US20050103636A1

Electricity

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

#4 | 2005-03-24

US20050062170A1

Electricity

I/C chip suitable for wire bonding

#5 | 2005-02-03

US20050026450A1

Electricity

Inhibition of tin oxide formation in lead free interconnect formation

#6 | 2005-02-03

US20050026416A1

Electricity

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

InventorID:

4609378 ⎘