Richardson, Texas
United States
7
2006-05-04
The entities that hold a legal rights for patent applications filed by inventor Li Lei:
Lei Li from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#2 | 2006-04-20Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#3 | 2005-12-01Semiconductor wafer with ditched scribe street
#4 | 2005-10-13Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#5 | 2005-10-13Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#6 | 2005-09-29Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#7 | 2005-09-22Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
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