Poughkeepsie, New York
United States
257
2020-06-04
The entities that hold a legal rights for patent applications filed by inventor CAMPBELL Levi A.:
Levi A. CAMPBELL from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Effectiveness-weighted control of cooling system components
#2 | 2020-01-09Fuel vaporization using data center waste heat
#3 | 2019-05-23Composite heat sink structures
#4 | 2019-05-16Protective cover assembly for air-moving assembly
#5 | 2019-05-02Pump with integrated bypass mechanism
#6 | 2018-12-27PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY
#7 | 2018-12-06Mechanically actuated safety compliant fan finger guard structures and methods
#8 | 2018-12-06Solenoid actuated safety compliant fan finger guard structures and methods
#9 | 2018-12-06Safety compliant fan finger guard integrated with anti-recirculation structure and method
#10 | 2018-11-15Fuel vaporization using data center waste heat
#11 | 2018-10-11Effectiveness-weighted control of cooling system components
#12 | 2018-04-19Tamper-proof electronic packages with two-phase dielectric fluid
#13 | 2018-04-05Protective louver assembly for air-moving assembly
#14 | 2018-03-22Composite heat sink structures
#15 | 2018-03-15Thermoelectric-enhanced, inlet air-cooled thermal conductors
#16 | 2017-11-02Tamper-proof electronic packages with two-phase dielectric fluid
#17 | 2017-10-19Electronics cooling assembly with multi-position, airflow-blocking mechanism
#18 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#19 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#20 | 2017-02-16Thermoelectric-enhanced, inlet air-cooled thermal conductors
#21 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#22 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#23 | 2017-01-26Measurement of particulate matter deliquescence relative humidity
#24 | 2017-01-26Measurement of particulate matter deliquescence relative humidity
#25 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#26 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#27 | 2016-12-15Fuel vaporization using data center waste heat
#28 | 2016-12-15Fuel vaporization using data center waste heat
#29 | 2016-11-22Air-moving assembly with auxiliary turbine drive
#30 | 2016-11-22Thermoelectric-enhanced, inlet air-cooled thermal conductors
#31 | 2016-10-06Heat sink structure with a vapor-permeable membrane for two-phase cooling
#32 | 2016-10-04Tile assemblies faciliating failover airflow into cold air containment aisle
#33 | 2016-06-16Protective cover assembly for air-moving assembly
#34 | 2016-05-19Fuel vaporization using data center waste heat
#35 | 2016-05-19Composite heat sink structures
#36 | 2016-05-19Liquid-cooled heat sink assemblies
#37 | 2016-05-19Liquid-cooled heat sink assemblies
#38 | 2016-05-19Fuel vaporization using data center waste heat
#39 | 2016-05-19Composite heat sink structures
#40 | 2016-03-31Interlock assembly for air-moving assembly
#41 | 2016-03-31Interlock assembly for air-moving assembly
#42 | 2016-03-31Protective louver assembly for air-moving assembly
#43 | 2016-03-31Locking louver assembly for air-moving assembly
#44 | 2016-03-31Protective louver assembly for air-moving assembly
#45 | 2016-03-31Locking louver assembly for air-moving assembly
#46 | 2016-03-24Effectiveness-weighted control of cooling system components
#47 | 2016-02-18Multi-component electronic module with integral coolant-cooling
#48 | 2015-12-10Selective clamping of electronics card to coolant-cooled structure
#49 | 2015-12-10Fabricating a liquid-cooling apparatus with coolant filter
#50 | 2015-12-10Coolant-cooled heat sink configured for accelerating coolant flow
#51 | 2015-12-10Field-replaceable bank of immersion-cooled electronic components
#52 | 2015-12-03Pump-enhanced, immersion-cooling of electronic compnent(s)
#53 | 2015-06-18Liquid-cooling apparatus with integrated coolant filter
#54 | 2015-04-23Pump-enhanced, immersion-cooling of electronic component(s)
#55 | 2015-04-23Direct coolant contact vapor condensing
#56 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
#57 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components
#58 | 2015-04-23Coolant-cooled heat sink configured for accelerating coolant flow
#59 | 2015-03-19Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly
#60 | 2015-03-05Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#61 | 2015-02-26Fabricating multi-component electronic module with integral coolant-cooling
#62 | 2015-02-26Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
#63 | 2015-02-26Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)
#64 | 2015-02-26Selective clamping of electronics card to coolant-cooled structure
#65 | 2015-02-19Methods of fabricating a coolant-cooled electronic assembly
#66 | 2015-02-05Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#67 | 2014-10-16Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
#68 | 2014-09-11Multi-component electronic module with integral coolant-cooling
#69 | 2014-09-04Selective clamping of electronics card to coolant-cooled structure
#70 | 2014-09-04Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
#71 | 2014-08-28Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)
#72 | 2014-08-28Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)
#73 | 2014-06-12Effectiveness-weighted control method for a cooling system
#74 | 2014-06-12Effectiveness-weighted control of cooling system components
#75 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#76 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#77 | 2014-05-29Immersion-cooled and conduction-cooled method for electronic system
#78 | 2014-05-29Immersion-cooled and conduction-cooled electronic system
#79 | 2014-05-15Air-cooling and vapor-condensing door assembly
#80 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#81 | 2014-05-15Air-cooling and vapor-condensing door assembly
#82 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#83 | 2014-05-08Separate control of coolant flow through coolant circuits
#84 | 2014-05-08Separate control of coolant flow through coolant circuits
#85 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#86 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#87 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#88 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#89 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#90 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#91 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#92 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#93 | 2014-04-17Cooling system with automated seasonal freeze protection
#94 | 2014-04-17Cooling method with automated seasonal freeze protection
#95 | 2014-04-17Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater
#96 | 2014-04-10Heat sink structure with a vapor-permeable membrane for two-phase cooling
#97 | 2014-04-10Heat sink structure with a vapor-permeable membrane for two-phase cooling
#98 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
#99 | 2014-03-27Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#100 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
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