Fishkill, New York
United States
125
2017-11-02
The entities that hold a legal rights for patent applications filed by inventor DAVID Milnes P.:
Milnes P. DAVID from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Tamper-proof electronic packages with two-phase dielectric fluid
#2 | 2017-10-19Electronics cooling assembly with multi-position, airflow-blocking mechanism
#3 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#4 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#5 | 2017-02-16Thermoelectric-enhanced, inlet air-cooled thermal conductors
#6 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#7 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#8 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#9 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#10 | 2016-12-15Fuel vaporization using data center waste heat
#11 | 2016-12-15Fuel vaporization using data center waste heat
#12 | 2016-12-08Air-moving assemblies with flywheels
#13 | 2016-11-22Air-moving assembly with auxiliary turbine drive
#14 | 2016-11-22Thermoelectric-enhanced, inlet air-cooled thermal conductors
#15 | 2016-10-06Heat sink structure with a vapor-permeable membrane for two-phase cooling
#16 | 2016-10-04Tile assemblies faciliating failover airflow into cold air containment aisle
#17 | 2016-06-16Protective cover assembly for air-moving assembly
#18 | 2016-05-19Fuel vaporization using data center waste heat
#19 | 2016-05-19Composite heat sink structures
#20 | 2016-05-19Liquid-cooled heat sink assemblies
#21 | 2016-05-19Liquid-cooled heat sink assemblies
#22 | 2016-05-19Fuel vaporization using data center waste heat
#23 | 2016-05-19Composite heat sink structures
#24 | 2016-03-31Interlock assembly for air-moving assembly
#25 | 2016-03-31Interlock assembly for air-moving assembly
#26 | 2016-03-31Protective louver assembly for air-moving assembly
#27 | 2016-03-31Locking louver assembly for air-moving assembly
#28 | 2016-03-31Protective louver assembly for air-moving assembly
#29 | 2016-03-31Locking louver assembly for air-moving assembly
#30 | 2016-03-24Effectiveness-weighted control of cooling system components
#31 | 2016-03-24Air-moving assemblies with flywheels
#32 | 2016-03-24Air-moving assemblies with flywheels
#33 | 2015-12-10Fabricating a liquid-cooling apparatus with coolant filter
#34 | 2015-12-10Coolant-cooled heat sink configured for accelerating coolant flow
#35 | 2015-12-10Field-replaceable bank of immersion-cooled electronic components
#36 | 2015-12-03Pump-enhanced, immersion-cooling of electronic compnent(s)
#37 | 2015-11-05Coolant and ambient temperature control for chillerless liquid cooled data centers
#38 | 2015-06-18Liquid-cooling apparatus with integrated coolant filter
#39 | 2015-04-23Pump-enhanced, immersion-cooling of electronic component(s)
#40 | 2015-04-23Direct coolant contact vapor condensing
#41 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
#42 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components
#43 | 2015-04-23Coolant-cooled heat sink configured for accelerating coolant flow
#44 | 2015-03-05Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#45 | 2015-02-05Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#46 | 2014-06-12Effectiveness-weighted control method for a cooling system
#47 | 2014-06-12Effectiveness-weighted control of cooling system components
#48 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#49 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#50 | 2014-05-29Immersion-cooled and conduction-cooled method for electronic system
#51 | 2014-05-29Immersion-cooled and conduction-cooled electronic system
#52 | 2014-05-15Air-cooling and vapor-condensing door assembly
#53 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#54 | 2014-05-15Air-cooling and vapor-condensing door assembly
#55 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#56 | 2014-05-08Separate control of coolant flow through coolant circuits
#57 | 2014-05-08Separate control of coolant flow through coolant circuits
#58 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#59 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#60 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#61 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#62 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#63 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#64 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#65 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#66 | 2014-04-17Cooling system with automated seasonal freeze protection
#67 | 2014-04-17Cooling method with automated seasonal freeze protection
#68 | 2014-04-10Heat sink structure with a vapor-permeable membrane for two-phase cooling
#69 | 2014-04-10Heat sink structure with a vapor-permeable membrane for two-phase cooling
#70 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
#71 | 2014-03-27Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#72 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
#73 | 2014-03-27Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#74 | 2014-03-13Coolant drip facilitating partial immersion-cooling of electronic components
#75 | 2014-03-13Vapor condenser with three-dimensional folded structure
#76 | 2014-03-13Thermoelectric-enhanced air and liquid cooling of an electronic system
#77 | 2014-03-13Thermoelectric-enhanced air and liquid cooling of an electronic system
#78 | 2014-03-13Vapor condenser with three-dimensional folded structure
#79 | 2014-02-27Contaminant separator for a vapor-compression refrigeration apparatus
#80 | 2014-02-20Heat sink structure with a vapor-permeable membrane for two-phase cooling
#81 | 2014-02-20Heat sink structure with a vapor-permeable membrane for two-phase cooling
#82 | 2014-02-20Heat sink structure with a vapor-permeable membrane for two-phase cooling
#83 | 2014-02-20Thermal expansion-enhanced heat sink for an electronic assembly
#84 | 2013-12-26Controlled cooling of an electronic system based on projected conditions
#85 | 2013-12-26Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
#86 | 2013-12-26Controlled cooling of an electronic system based on projected conditions
#87 | 2013-12-26Controlled cooling of an electronic system for reduced energy consumption
#88 | 2013-12-26Controlled cooling of an electronic system for reduced energy consumption
#89 | 2013-10-10Coolant and ambient temperature control for chillerless liquid cooled data centers
#90 | 2013-05-30Dynamically limiting energy consumed by cooling apparatus
#91 | 2013-05-30Dynamically limiting energy consumed by cooling apparatus
#92 | 2013-05-30Direct facility coolant cooling of a rack-mounted heat exchanger
#93 | 2013-05-30Direct facility coolant cooling of a rack-mounted heat exchanger
#94 | 2013-05-23Thermal resistance-based monitoring of cooling of an electronic component
#95 | 2013-05-02Coolant manifold with separately rotatable manifold section(s)
#96 | 2013-05-02Multi-rack assembly with shared cooling apparatus
#97 | 2013-05-02Multi-rack assembly with shared cooling unit
#98 | 2013-05-02Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)
#99 | 2013-05-02Multi-fluid, two-phase immersion-cooling of electronic component(s)
#100 | 2013-05-02Coolant manifold with separately rotatable manifold section(s)
46097 ⎘