Benjamin C. Liu

City:

Silver Spring, Maryland

Country:

United States

Published Applications:

Last publication date:

2006-04-27

Top Assignees for applications by Benjamin C. Liu

The entities that hold a legal rights for patent applications filed by inventor Liu Benjamin C.:

Northrop Grumman Corporation 1 Los Angeles, CA United States

Recent patent applications by Liu Benjamin C.

Benjamin C. Liu from Silver Spring, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-04-27

US20060087068A1

Performing operations; transporting

Anti-toppling device for mail with retractable protrusion

InventorID:

4613352 ⎘