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Inventor profile of:

Ping Wang

City:

Hudson, Ohio

Country:

United States

Published Applications:

3

Last publication date:

2024-05-16

Top Assignees for applications by Ping Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Ping:

Toyota Motor Corporation 2 Toyota, Japan
THE UNIVERSITY OF AKRON 2 Akron, OH United States
UNIVERSITY OF AKRON 1 Akron, OH United States
Toyota Motor Corporation 1 Toyota-shi Aichi-ken, Japan
Toyota Motor Engineering Manufacturing North America, Inc. 1 Erlanger, KY United States
Regents of the University of Minnesota 1 Minneapolis, MN United States
Toyota Motor Engineering & Manufacturing North America, Inc. 1 Plano, TX United States
Toyota Engineering & Manufacturing North America, Inc. 1 Erlanger, KY United States

Recent patent applications by Wang Ping

Ping Wang from Hudson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-16

US20240158722A1

Chemistry; metallurgy

Compositions for facilitating the removal of a fingerprint

#2 | 2008-05-22

US20080119381A1

Chemistry; metallurgy

Biofunctional materials

#3 | 2006-05-04

US20060094096A1

Chemistry; metallurgy

Fibrous protein-immobilization systems

InventorID:

4618551 ⎘