William E. Eckles

City:

Cleveland Hts., Ohio

Country:

United States

Published Applications:

Last publication date:

2007-03-27

Top Assignees for applications by William E. Eckles

The entities that hold a legal rights for patent applications filed by inventor Eckles William E.:

Taskem, Inc. 1 Brooklyn Heights, OH United States

Recent patent applications by Eckles William E.

William E. Eckles from Cleveland Hts., US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-03-27

US10456714

Tin alloy electroplating system

#2 | 2006-05-11

US20060096867A1

Chemistry; metallurgy

Tin alloy electroplating system

#3 | 2005-08-11

US20050173255A1

Chemistry; metallurgy

Electroplated quaternary alloys

#4 | 2005-08-11

US20050173254A1

Chemistry; metallurgy

Nickel cobalt boron ternary alloys

InventorID:

4620642 ⎘